Sputtering is one of the main techniques for preparing thin film materials. It uses the ions generated by the ion source to accelerate the accumulation of ions in vacuum, form a high-speed ion beam, bombard the solid surface, and exchange energy between the ions and the surface of the solid surface, so that the atoms on the solid surface and the solid and the solid surface are deposited on the surface of the base up and bombarded. The solid is the raw material for sputtering thin films and is called the sputtering target.
Classification of sputtering targets
1. According to the ingredients
Metal target
(Nickel Target, Ni, Titanium Target, Ti, Zinc Target, Zn, Chromium Target, Cr, Magnesium Target, Mg, Niobium Target, Nb, Tin Target, Sn, Aluminum Target, Al, Indium Target, In, Iron Target, Fe , zirconium aluminum target, ZrAl, titanium aluminum target, TiAl, zirconium target, Zr, aluminum silicon target, AlSi, silicon target, Si, copper target Cu, tantalum target T, a, germanium target, Ge, silver target, Ag, cobalt Target, Co, Gold target, Au, Gadolinium target, Gd, Lanthanum target, La, Yttrium target, Y, Cerium target, Ce, Tungsten target, W, Stainless steel target, NiCr target, NiCr, Hafnium target, Hf, Molybdenum target , Mo, iron-nickel target, FeNi, tungsten target, W, etc.)
Alloy target
(FeCo target FeCo, aluminum silicon target AlSi, titanium silicon target TiSi, chromium silicon target CrSi, zinc aluminum target ZnAl, titanium zinc target TiZn, titanium aluminum target TiAl, titanium zirconium target TiZr, titanium silicon target TiSi, titanium nickel target TiNi, nickel-chromium target NiCr, nickel-aluminum target NiAl, nickel-vanadium target NiV, nickel-iron target NiFe, etc.)
Ceramic compound target
(ITO target, magnesium oxide target, iron oxide target, silicon nitride target, silicon carbide target, titanium nitride target, chromium oxide target, zinc oxide target, zinc sulfide target, silicon dioxide target, silicon monoxide target, cerium oxide Target, zirconium dioxide target, niobium pentoxide target, titanium dioxide target, zirconium dioxide target, hafnium dioxide target, titanium diboride target, zirconium diboride target, tungsten trioxide target, aluminum oxide target five Tantalum oxide, niobium pentoxide target, magnesium fluoride target, yttrium fluoride target, zinc selenide target, aluminum nitride target, silicon nitride target, boron nitride target, titanium nitride target, silicon carbide target, niobium Lithium oxide target, praseodymium titanate target, barium titanate target, lanthanum titanate target, nickel oxide target, sputtering target, etc.)
2. According to the shape
Can be divided into square target, round target, special-shaped target
3. According to the application field
Divided into microelectronic target, magnetic recording target, optical disc target, precious metal target, thin film resistance target, conductive film target, surface modification target, mask layer target, decorative layer target, electrode target , package targets, other targets
Application of sputtering targets
Sputtering targets are mainly used in electronics and information industries, such as integrated circuits
Information storage
  LCD
Laser memory
Electronic control devices, etc.
It can also be used in the field of glass coating;
It can also be used in wear-resistant materials, high temperature corrosion resistance, decorative products and other industries.
4. The sputtering target is different according to the application
It is further divided into semiconductor related ceramic targets, recording medium ceramic targets, display ceramic targets, superconducting ceramic targets and giant magnetoresistance ceramic targets, etc.