The rapid development of integrated circuits is inseparable from the support of materials and system integration technology. High-purity metal sputtering targets are used as key materials for physical vapor deposition (PVD) processes in chip manufacturing and packaging, and are used in the preparation of various functional thin films. Its development and growth can not only greatly promote the upgrading of the upstream industrial structure of traditional non-ferrous metal materials in my country, but also promote the technological progress and stable and rapid development of the downstream electronic manufacturing industry.
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Domestic high-purity sputtering target companies emerge
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Growing various thin films with important functions on semiconductor substrates (substrates) is one of the core processes in the manufacture of integrated circuit chips. The sputtering process based on physical vapor deposition (PVD) has the advantages of high film purity, good film quality, fast deposition speed, and stable and reliable process. It is widely used in integrated circuit manufacturing and is irreplaceable. The raw material of sputtering deposition film is the target material. The chemical purity and organizational properties of the target material directly determine the performance of the contact layer, dielectric layer, interconnect layer and other films in the chip, thus affecting the performance and life of electronic products. The chip has very high requirements on the sputtering target, and it requires that the purity of the target should reach more than 5N (99.999%).